ARMY TM 9-6115-464-34
AIR FORCE 35C2-3-445-2
NAVY NAVFAC P-8-624-34
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Figure 3-78. Electro-Hydraulic Governor Control Unit Frequency Sensing Test Circuit
Place the container in a temperature controlled oven. Set the oven temperature at +180 to + 185°F
(+82.2°C to +85°C) and allow the container to soak 11 to 12 hours or until potting compound is
completely melted.
Prior to installing the printed circuit board, remove the container from the oven and make sure that
insulation paper is positioned next to the container shell.
Using heavy gloves and safety glasses, slowly lower the printed circuit board into the potting
compound.
WARNING
Use care not to splash hot potting compound on operating personnel. It can cause
severe injury. Failure to observe this warning could result in servere personal injury or
death.
Position the printed circuit board and allow compound to cool.
When compound has cooled and is substantially solid, install top cover and hardware.
(1) Refer to figure 3-81 for approximate position of controls when connecting linkage. Use figure 3-82
for generators with serial No RZ0001.
3-178
i. Installation
